Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US17716208Application Date: 2022-04-08
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Publication No.: US12125643B2Publication Date: 2024-10-22
- Inventor: Jeong Bong Park , Da Jeong Han
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20210174656 2021.12.08
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G2/06 ; H01G4/012 ; H01G4/12 ; H01G4/232

Abstract:
A multilayer electronic component includes a body including a plurality of dielectric layers, and a capacitance formation portion including first and second internal electrodes alternately disposed in a third direction with the dielectric layer interposed therebetween, the body including first and second surfaces opposing in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing in the third direction, external electrodes disposed on the body, and a dummy electrode disposed to penetrate through the capacitance formation portion in the third direction.
Public/Granted literature
- US20230178301A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2023-06-08
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