Invention Grant
- Patent Title: In-line power device, semiconductor assembly, in-wheel motor driver or vehicle driver and new-energy vehicle
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Application No.: US17287504Application Date: 2019-07-19
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Publication No.: US12125770B2Publication Date: 2024-10-22
- Inventor: Chunxian Ye , Xubiao Zhan , Tao Li , Shengchao Ruan
- Applicant: Shenzhenshi Pengyuan Electronics Co., Ltd.
- Applicant Address: CN Guangdong
- Assignee: SHENZHENSHI PENGYUAN ELECTRONICS CO., LTD.
- Current Assignee: SHENZHENSHI PENGYUAN ELECTRONICS CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: BakerHostetler
- Priority: CN 1910277415.6 2019.04.08 CN 1920465783.9 2019.04.08
- International Application: PCT/CN2019/096825 2019.07.19
- International Announcement: WO2020/206867A 2020.10.15
- Date entered country: 2021-04-21
- Main IPC: H02M7/00
- IPC: H02M7/00 ; H01L23/31 ; H01L23/49 ; H01L23/495 ; H02K11/33

Abstract:
An in-line power device, a semiconductor assembly, an in-wheel motor driver or a vehicle driver, and a new-energy vehicle are provided. The in-line power device includes: a body including a power chip and a wrapping layer wrapping an outer surface of the power chip; and a plurality of pins provided at a first side of the body at intervals. The plurality of pins includes a power pin, an auxiliary control pin and a control signal pin, and each pin includes a first segment provided inside the wrapping layer and a second segment provided outside the wrapping layer. The second segment of the auxiliary control pin and the second segment of the control signal pin are located in a first plane, the second segment of the power pin and the first side are located in a second plane, and the first plane is not parallel to the second plane.
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