Invention Grant
- Patent Title: Semiconductor device and method
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Application No.: US15355783Application Date: 2016-11-18
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Publication No.: US12125876B2Publication Date: 2024-10-22
- Inventor: Kuan-Cheng Wang , Han-Ti Hsiaw
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/02 ; H01L21/311 ; H01L21/3115 ; H01L21/8234 ; H01L27/088 ; H01L29/66 ; H01L29/78 ; H01L21/8238

Abstract:
FinFET structures and methods of forming the same are disclosed. In a method, a fin is formed on a substrate, an isolation region is formed on opposing sides of the fin. The isolation region is doped with carbon to form a doped region, and a portion of the isolation region is removed to expose a top portion of the fin, wherein the removed portion of the isolation region includes at least a portion of the doped region.
Public/Granted literature
- US20180145131A1 Semiconductor Device and Method Public/Granted day:2018-05-24
Information query
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