Invention Grant
- Patent Title: Glass mounted electronic assembly
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Application No.: US17569079Application Date: 2022-01-05
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Publication No.: US12126126B2Publication Date: 2024-10-22
- Inventor: M. Jarod Scherer , Stefanie Merry , Tyler Folger
- Applicant: Aptiv Technologies AG
- Applicant Address: CH Schaffhausen
- Assignee: APTIV TECHNOLOGIES AG
- Current Assignee: APTIV TECHNOLOGIES AG
- Current Assignee Address: CH Schaffhausen
- Agency: Billion & Armitage
- Main IPC: H01R24/00
- IPC: H01R24/00 ; H01Q1/12 ; H01Q1/24 ; H01R24/50 ; H01R43/20 ; H05K1/14 ; H05K1/18 ; H05K5/00 ; H01R12/52 ; H01R12/55

Abstract:
An electronic assembly includes a circuit board having a plurality of conductive traces and electronic components forming an electronic circuit disposed thereon, a plurality of flexible electrical terminals configured to attach to electrical contacts disposed on a glass surface and electrically connected to the plurality of conductive traces, and a coaxial cable connector electrically connected to the plurality of conductive traces. A method of manufacturing an electronic assembly, e.g., the electronic assembly described above, is also presented herein.
Public/Granted literature
- US20220294164A1 GLASS MOUNTED ELECTRONIC ASSEMBLY Public/Granted day:2022-09-15
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