Invention Grant
- Patent Title: Solid-state imaging device and electronic apparatus for miniaturization of pixels and improving light detection sensitivity
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Application No.: US18342791Application Date: 2023-06-28
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Publication No.: US12126923B2Publication Date: 2024-10-22
- Inventor: Shinpei Fukuoka , Hideaki Togashi , Yoshihiro Ando , Masashi Nakata
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: CHIP LAW GROUP
- Priority: JP 17159231 2017.08.22
- Main IPC: H04N5/335
- IPC: H04N5/335 ; H04N25/704 ; H04N25/77 ; H10K19/20 ; H10K39/32 ; H01L27/146

Abstract:
Provided is a solid-state imaging device including a substrate having a pixel array unit sectioned into a matrix, a plurality of normal pixels, a plurality of phase difference detection pixels, and a plurality of adjacent pixels adjacent to the phase difference detection pixels, each provided in each of the plurality of sections. Further, each of the normal pixel, the phase difference detection pixel, and the adjacent pixel has a photoelectric conversion film, and an upper electrode and a lower electrode that sandwich the photoelectric conversion film in a thickness direction of the photoelectric conversion film. Furthermore, the lower electrode, in the adjacent pixel, extends from the section in which the adjacent pixel is provided to cover the section in which the phase difference detection pixel adjacent to the adjacent pixel is provided, when viewed from above the substrate.
Public/Granted literature
- US20230362508A1 SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2023-11-09
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