Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US17667459Application Date: 2022-02-08
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Publication No.: US12131918B2Publication Date: 2024-10-29
- Inventor: Sang Min Lee , Seung Hoon Oh , Yong Joon Im , Hyo Won Yang
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Cheonan-si
- Priority: KR 20210040673 2021.03.29
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/04 ; F26B5/00
Abstract:
A substrate processing apparatus includes a process chamber including a first body and a second body that are coupled to each other to form a processing space therein, a clamping member configured to clamp the first body and the second body, and an anti-friction member mounted in a groove formed in a contact region between the first body or the second body and the clamping member.
Public/Granted literature
- US20220305536A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2022-09-29
Information query
IPC分类:
