Invention Grant
- Patent Title: FinFET with shorter fin height in drain region than source region and related method
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Application No.: US17452651Application Date: 2021-10-28
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Publication No.: US12132080B2Publication Date: 2024-10-29
- Inventor: Man Gu , Wenjun Li
- Applicant: GlobalFoundries U.S. Inc.
- Applicant Address: US NY Malta
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US NY Malta
- Agency: Hoffman Warnick LLC
- Agent Anthony Canale
- The original application number of the division: US16936524 2020.07.23
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/417 ; H01L29/66

Abstract:
A FinFET includes a semiconductor fin, and a source region and a drain region in the same semiconductor fin. The drain region has a first fin height above a trench isolation; and the source region has a second fin height above the trench isolation. The first fin height is less than the second fin height. The FinFET may be used, for example, in a scaled laterally diffused metal-oxide semiconductor (LDMOS) application, and exhibits reduced parasitic capacitance for improved radio frequency (RF) performance. A drain extension region may have the first fin height, and a channel region may have the second fin height. A method of making the FinFET is also disclosed.
Information query
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