Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US17706301Application Date: 2022-03-28
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Publication No.: US12132083B2Publication Date: 2024-10-29
- Inventor: Shingo Hayashi , Akimasa Kinoshita
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JP 21087221 2021.05.24
- Main IPC: H01L29/16
- IPC: H01L29/16

Abstract:
A silicon carbide semiconductor device has a silicon carbide semiconductor substrate of a first conductivity type, a first semiconductor layer of the first conductivity type, a second semiconductor layer of a second conductivity type, first semiconductor regions of the first conductivity type, second semiconductor regions of the second conductivity type, a gate insulating film, gate electrodes, first electrodes, a second electrode, and a gate pad portion configured by a gate electrode pad and a connecting portion. The second semiconductor layer includes a first region facing the connecting portion and a second region facing a corner portion of the gate electrode pad, and the first and second regions are free of the second semiconductor regions. The oxide film is provided on surfaces of the second semiconductor regions and the first and second regions, and the oxide film and the gate insulating film are made of a same material.
Public/Granted literature
- US20220376054A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2022-11-24
Information query
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