Invention Grant
- Patent Title: Semiconductor device structure with metal gate stack
-
Application No.: US18360110Application Date: 2023-07-27
-
Publication No.: US12132096B2Publication Date: 2024-10-29
- Inventor: Xusheng Wu , Chang-Miao Liu , Huiling Shang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- The original application number of the division: US16392130 2019.04.23
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L21/265 ; H01L21/28 ; H01L21/8234 ; H01L27/088 ; H01L29/423 ; H01L29/49 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a gate stack over the substrate. The semiconductor device structure also includes a spacer element over a sidewall of the gate stack. The spacer element is doped with a dopant, and the dopant reduces a dielectric constant of the spacer element. The spacer element has a first atomic concentration of the dopant near an inner surface of the spacer element adjacent to the gate stack. The spacer element has a second atomic concentration of the dopant near an outer surface of the spacer element. The first atomic concentration of the dopant is different than the second atomic concentration of the dopant.
Public/Granted literature
- US20230378321A1 SEMICONDUCTOR DEVICE STRUCTURE WITH METAL GATE STACK Public/Granted day:2023-11-23
Information query
IPC分类: