Invention Grant
- Patent Title: Semiconductor memory device and manufacturing method of semiconductor memory device
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Application No.: US17235577Application Date: 2021-04-20
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Publication No.: US12133379B2Publication Date: 2024-10-29
- Inventor: Nam Jae Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: WILLIAM PARK & ASSOCIATES LTD.
- Priority: KR 20200134645 2020.10.16
- Main IPC: H10B41/27
- IPC: H10B41/27 ; H10B41/10 ; H10B41/40 ; H10B43/10 ; H10B43/27 ; H10B43/40

Abstract:
There are provided a semiconductor memory device and a manufacturing method of the semiconductor memory device. The semiconductor memory device includes: a channel structure including a first pillar part and a second pillar part extending from the first pillar part; a blocking insulating layer surrounding a sidewall of the first pillar part; a data storage layer disposed between the first pillar part and the blocking insulating layer; an upper select line overlapping with an end portion of the blocking insulating layer and an end portion of the data storage layer, which face in an extending direction of the second pillar part, the upper select line surrounding a sidewall of the second pillar part; and a tunnel insulating layer disposed between the first pillar part and the data storage layer, the tunnel insulating layer extending between the second pillar part and the upper select line.
Public/Granted literature
- US20220123005A1 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2022-04-21
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