Invention Grant
- Patent Title: Semiconductor structure and method of forming the same
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Application No.: US18059073Application Date: 2022-11-28
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Publication No.: US12133470B2Publication Date: 2024-10-29
- Inventor: Harry-Hak-Lay Chuang , Kuei-Hung Shen , Chern-Yow Hsu , Shih-Chang Liu
- Applicant: Taiwan Semiconductor Manufacturing Company Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CPMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CPMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- The original application number of the division: US16931632 2020.07.17
- Main IPC: H10N50/10
- IPC: H10N50/10 ; H10B61/00 ; H10N50/01 ; H10N50/80

Abstract:
The present disclosure provides a semiconductor structure, including an Nth metal layer over a transistor region, where N is a natural number, and a bottom electrode over the Nth metal layer. The bottom electrode comprises a bottom portion having a first width, disposed in a bottom electrode via (BEVA), the first width being measured at a top surface of the BEVA, and an upper portion having a second width, disposed over the bottom portion. The semiconductor structure also includes a magnetic tunneling junction (MTJ) layer having a third width, disposed over the upper portion, a top electrode over the MTJ layer and an (N+1)th metal layer over the top electrode. The first width is greater than the third width.
Public/Granted literature
- US20230088093A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2023-03-23
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