A medical device housing having a reduced footprint is described. The medical device housing includes a flange coupled to a first portion of the housing and a second portion of the housing that is configured to be coupled to the flange to substantially enclose an electronic component(s) within an interior of the medical device housing. The first portion of the housing includes a support(s) that supports the flange within the first portion. In some examples, a trench is formed between an interior wall of the first portion of the housing and the flange. An adhesive is deposited within the trench to bond the flange to the first portion of the housing. The second portion of the housing is configured to decouple from the flange to allow access to the interior of the medical device housing, such as for maintenance or repairs.