Invention Grant
- Patent Title: Grinding method of workpiece
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Application No.: US17455492Application Date: 2021-11-18
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Publication No.: US12134165B2Publication Date: 2024-11-05
- Inventor: Satoru Fujimura
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JP2020-205662 20201211
- Main IPC: B24B51/00
- IPC: B24B51/00 ; B24B7/07 ; B24B49/04

Abstract:
A grinding method for grinding a workpiece includes a first grinding step of grinding the workpiece in such a manner that an outer circumferential part of the workpiece becomes thinner than a central part of the workpiece, a measurement step of measuring the thickness of the workpiece at the outer circumferential part, and a second grinding step of grinding the workpiece. In the second grinding step, the grinding is started from the central part of the workpiece and the grinding is ended when the workpiece reaches a finished thickness decided based on the thickness of the workpiece at the outer circumferential part measured in the measurement step.
Public/Granted literature
- US20220184774A1 GRINDING METHOD OF WORKPIECE Public/Granted day:2022-06-16
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