Invention Grant
- Patent Title: Molding device and molding method
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Application No.: US17634861Application Date: 2019-11-11
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Publication No.: US12134223B2Publication Date: 2024-11-05
- Inventor: Ryota Ozaki , Yuki Kani
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: HAUPTMAN HAM, LLP
- International Application: PCT/JP2019/044150 WO 20191111
- International Announcement: WO2021/095097 WO 20210520
- Main IPC: B29C53/04
- IPC: B29C53/04 ; B29C53/42 ; B29C53/82

Abstract:
A molding device is includes a mandrel that has an arc-shaped cross section; a roller that has a round-shaped cross section, is movable along a surface of the mandrel, and applies a pressing force to a material to be molded placed on the mandrel; a gripping unit that grips the material to be molded on an outside of the roller with respect to the mandrel and applies a tensile force to the material to be molded; a roller driving unit that moves the roller along the surface of the mandrel; a gripping-unit driving unit that moves the gripping unit. A control unit synchronizes a position of the roller and a position of the gripping unit with each other to control the roller driving unit and the gripping-unit driving unit so that the material to be molded is arranged in a direction perpendicular to a vertical direction of the mandrel.
Public/Granted literature
- US20220324156A1 MOLDING DEVICE AND MOLDING METHOD Public/Granted day:2022-10-13
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