Invention Grant
- Patent Title: Method and device for adhesively bonding substrates in film form and composite body obtained thereby
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Application No.: US17368379Application Date: 2021-07-06
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Publication No.: US12134257B2Publication Date: 2024-11-05
- Inventor: Hans-Georg Kinzelmann , Michael Gierlings
- Applicant: Henkel AG & Co. KGaA
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Priority: EP19151375 20190111
- Main IPC: B32B37/12
- IPC: B32B37/12 ; B32B7/12 ; B32B15/08 ; B32B27/08 ; B32B37/00 ; B32B37/04 ; B32B37/06 ; B32B37/08 ; B32B37/20
Abstract:
The present invention relates to a method for adhesively bonding substrates in film form, wherein one of the substrates has a thermoplastic surface which is converted into a softened state prior to adhesive bonding, and wherein the surface of this substrate that is opposite to the thermoplastic surface is cooled using a cooling roller. Furthermore, the present invention relates to a device for carrying out the method according to the invention.
Public/Granted literature
- US20220063258A1 METHOD AND DEVICE FOR ADHESIVELY BONDING SUBSTRATES IN FILM FORM AND COMPOSITE BODY OBTAINED THEREBY Public/Granted day:2022-03-03
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