Invention Grant
- Patent Title: Molded structures with channels
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Application No.: US18454771Application Date: 2023-08-23
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Publication No.: US12134274B2Publication Date: 2024-11-05
- Inventor: Chien-Hua Chen , Michael W. Cumbie , Michael G. Groh
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14 ; B41J2/18

Abstract:
An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten μm and two hundred μm, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.
Public/Granted literature
- US20230391086A1 MOLDED STRUCTURES WITH CHANNELS Public/Granted day:2023-12-07
Information query
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