An apparatus for processing cover windows includes a first mold including a first support a second support spaced apart from the first support, where the first support and second support are configured to hold processing targets; a second mold; and a third mold spaced apart from the second mold. The second mold includes a first pressurizing portion overlapping with the first support, having a first thickness, and a second pressurizing portion connected with the first pressurizing portion and configured to overlap with the first support, having a second thickness thinner than the first thickness. The third mold includes a third pressurizing portion overlapping with the second support, having a third thickness, and a fourth pressurizing portion connected with the third pressurizing portion and overlapping with the second support, having a fourth thickness thinner than the third thickness.