Invention Grant
- Patent Title: Compound, resin, composition, resist pattern formation method, circuit pattern formation method and method for purifying resin
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Application No.: US16966415Application Date: 2019-01-31
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Publication No.: US12134596B2Publication Date: 2024-11-05
- Inventor: Takashi Makinoshima , Junya Horiuchi , Masatoshi Echigo
- Applicant: Mitsubishi Gas Chemical Company, Inc.
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Fla
- Priority: JP2018-015520 20180131
- International Application: PCT/JP2019/003400 WO 20190131
- International Announcement: WO2019/151400 WO 20190808
- Main IPC: C07C43/295
- IPC: C07C43/295 ; C07C317/22 ; C07C321/30 ; C08G65/38 ; G03F7/022 ; G03F7/11 ; G03F7/20 ; G03F7/40
Abstract:
A compound represented by the following formula (1). The compound can be used as a film forming material for lithography or an optical component forming material. A resin may also be obtained using this compound as a monomer, a composition, a method for forming a resist pattern, a method for forming an insulating film, a method for forming a circuit pattern, and a method for purifying the above compound or resin.
Information query
