Invention Grant
- Patent Title: Two-component solvent-less adhesive composition
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Application No.: US17436531Application Date: 2020-03-04
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Publication No.: US12134715B2Publication Date: 2024-11-05
- Inventor: Tuoqi Li , Joseph J. Zupancic , Matthew M. Yonkey , Paul G. Clark , Thorsten Schmidt , Wenwen Li
- Applicant: Dow Global Technologies LLC , Rohm and Haas Company
- Applicant Address: US MI Midland; US PA Collegeville
- Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee Address: US MI Midland; US PA Collegeville
- Agency: Boyle Fredrickson, S.C.
- International Application: PCT/US2020/020874 WO 20200304
- International Announcement: WO2020/180921 WO 20200910
- Main IPC: C09J175/06
- IPC: C09J175/06 ; B32B7/12 ; B32B15/085 ; B32B27/08 ; B32B27/32 ; B32B27/36 ; C08G18/12 ; C08G18/44 ; C08G18/46 ; C08G18/73
Abstract:
The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component; and (B) a polyol component containing (i) a polyester-polycarbonate polyol and (ii) a phosphate-terminated polyol. The present disclosure also provides a method of forming the two-component solvent-less adhesive composition.
Public/Granted literature
- US20220177752A1 Two-Component Solvent-Less Adhesive Composition Public/Granted day:2022-06-09
Information query
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