Invention Grant
- Patent Title: Electronic device comprising sensor module
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Application No.: US17521186Application Date: 2021-11-08
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Publication No.: US12135590B2Publication Date: 2024-11-05
- Inventor: Byungseon Hwang , Deokhee Lee , Sunggyu Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2019-0055914 20190513
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06V40/13

Abstract:
An electronic device is provided. The electronic device includes a housing and a sensor module disposed in at least a portion of the housing. The sensor module includes a fingerprint recognition sensor, a protective layer covering the fingerprint recognition sensor, an adhesive member placed on the protective layer, and a ceramic layer placed on the adhesive member, wherein the edge of the ceramic layer, the edge of the adhesive member, and the edge of a part of the protective layer include machined surfaces. Other embodiments are also possible.
Public/Granted literature
- US20220057846A1 ELECTRONIC DEVICE COMPRISING SENSOR MODULE Public/Granted day:2022-02-24
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