Invention Grant
- Patent Title: Tetragonal half metallic half-Heusler compounds
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Application No.: US17710399Application Date: 2022-03-31
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Publication No.: US12136447B2Publication Date: 2024-11-05
- Inventor: Sergey Faleev , Panagiotis Charilaos Filippou , Yari Ferrante , Chirag Garg , Mahesh Samant , Jaewoo Jeong
- Applicant: International Business Machines Corporation , Samsung Electronics Co., Ltd.
- Applicant Address: US NY Armonk; KR Gyeonggi-do
- Assignee: International Business Machines Corporation,Samsung Electronics Co., Ltd.
- Current Assignee: International Business Machines Corporation,Samsung Electronics Co., Ltd.
- Current Assignee Address: US NY Armonk; KR Gyeonggi-do
- Agency: Otterstedt & Kammer PLLC
- Agent Erik Johnson
- Main IPC: G11C16/04
- IPC: G11C16/04 ; G11C11/16 ; H10B61/00 ; H10N50/01 ; H10N50/10 ; H10N50/85

Abstract:
A magnetoresistive random-access memory cell includes a templating layer. The templating layer includes a binary alloy having an alternating layer lattice structure. The cell further includes a half metallic half-Heusler layer including a half metallic half-Heusler material having a tetragonal lattice structure. The half metallic half-Heusler layer is located outward of the templating layer, and has a half-Heusler in-plane lattice constant that is different from an in-plane lattice constant in a cubic form of the half metallic half-Heusler material. A tunnel barrier is located outward of the half metallic half-Heusler layer, and a magnetic layer is located outward of the tunnel barrier.
Public/Granted literature
- US20230317129A1 TETRAGONAL HALF METALLIC HALF-HEUSLER COMPOUNDS Public/Granted day:2023-10-05
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