Invention Grant
- Patent Title: Miniaturized isolator modules for intrinsic safety applications
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Application No.: US17513850Application Date: 2021-10-28
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Publication No.: US12136513B2Publication Date: 2024-11-05
- Inventor: Mark Stewart Cantrell , Keith W. Bennett
- Applicant: Analog Devices, Inc.
- Applicant Address: US MA Wilmington
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Wilmington
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/24 ; H02H9/00 ; H02H9/04

Abstract:
Aspects of the present disclosure provide miniaturized isolator modules capable of transferring power and/or data signals across an isolation barrier by way of a transformer while maintaining intrinsic safety (IS) compliance. For example, the isolator modules may provide power from a non-IS side to an IS side of the isolation barrier while protecting the IS side in the event of an overvoltage and/or overcurrent event on the non-IS side. In some aspects, an isolator module includes one or more silicon protection devices, which facilitate the miniaturization of the isolator module while maintaining protection against overvoltage and/or overcurrent events in accordance with IS standards. In some aspects, an isolator module includes a transformer adapted for IS compliance. For example, coils of the transformer may be disposed on opposing sides of an isolation barrier having a thickness of at least 200 microns. Some aspects provide silicon protection devices formed on a single semiconductor die for use with miniaturized isolator modules to provide overvoltage and/or overcurrent protection for IS compliance. Miniaturized isolator modules and protection devices described herein may be used either alone or in combination, in IS or non-IS environments.
Public/Granted literature
- US2566115A Alloy for cathode element Public/Granted day:1951-08-28
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