Invention Grant
- Patent Title: Multilayer capacitor and board having the same mounted thereon
-
Application No.: US17973727Application Date: 2022-10-26
-
Publication No.: US12136523B2Publication Date: 2024-11-05
- Inventor: Hwi Dae Kim , Ji Hong Jo , Woo Chul Shin , Chan Yoon , Sang Soo Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0086597 20190717
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G2/02 ; H01G4/012 ; H01G4/12

Abstract:
A multilayer capacitor and a board having the multilayer capacitor mounted thereon are provided. The multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes, and first and second external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the first and second internal electrodes, respectively. A/B satisfies 0.0016≤A/B
Public/Granted literature
- US20230061474A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON Public/Granted day:2023-03-02
Information query