Invention Grant
- Patent Title: Plasma processing apparatus and plasma processing method
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Application No.: US17519596Application Date: 2021-11-05
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Publication No.: US12136535B2Publication Date: 2024-11-05
- Inventor: Tatsuro Ohshita , Koichi Nagami
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP2020-185140 20201105,JP2021-149309 20210914
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H03H7/38

Abstract:
There is a plasma processing apparatus comprising: a chamber; a substrate support provided in the chamber, the substrate support including a bias electrode; a plasma generator configured to generate plasma from a gas in the chamber; and a bias power supply electrically connected to the bias electrode and configured to generate a sequence of a plurality of voltage pulses applied to the bias electrode, wherein each of the plurality of voltage pulses has a leading edge period in which the voltage pulse transitions from a reference voltage level to a pulse voltage level and a trailing edge period in which the voltage pulse transitions from the pulse voltage level to the reference voltage level, and at least one of a time length of the leading edge period and a time length of the trailing edge period is greater than 0 seconds and less than or equal to 0.5 microseconds.
Public/Granted literature
- US20220139672A1 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD Public/Granted day:2022-05-05
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