Invention Grant
- Patent Title: Cost effective radio frequency impedance matching networks
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Application No.: US17963146Application Date: 2022-10-10
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Publication No.: US12136537B2Publication Date: 2024-11-05
- Inventor: Yue Guo , Kartik Ramaswamy , Farhad Moghadam , Yang Yang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H03H7/40

Abstract:
Embodiments provided herein generally include apparatus and methods in a plasma processing system for rapid and inexpensive repair and replacement of RF sensors necessary for the operation of radio frequency (RF) power generation and impedance matching equipment used for generating a plasma in a plasma chamber during semiconductor processing therein. Flexible communications between equipment of the plasma processing system allows sharing of process information and equipment settings for batch processing of a plurality of semiconductor wafers during the manufacturing process. Operational settings of a master plasma processing system may be used to control the operation of a plurality of slave processing systems. In addition, the operational settings of the master plasma processing system may be recorded and reused for controlling the plurality of slave processing systems.
Public/Granted literature
- US20240120178A1 COST EFFECTIVE RADIO FREQUENCY IMPEDANCE MATCHING NETWORKS Public/Granted day:2024-04-11
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