Invention Grant
- Patent Title: Integrated substrate measurement system to improve manufacturing process performance
-
Application No.: US18335899Application Date: 2023-06-15
-
Publication No.: US12136557B2Publication Date: 2024-11-05
- Inventor: Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/66
Abstract:
A process recipe associated with a substrate at a manufacturing system is identified. A first set of measurements for the substrate is obtained from a substrate measurement subsystem. A second set of measurements for the substrate is obtained from one or more sensors of a chamber of the manufacturing system. A determination is made based on the obtained first set of measurements and the obtained second set of measurements of whether to modify the process recipe by at least one of modifying an operation of the process recipe or generating an instruction to prevent completion of execution of one or more operations of the process recipe.
Public/Granted literature
- US12191176B2 Integrated substrate measurement system to improve manufacturing process performance Public/Granted day:2025-01-07
Information query
IPC分类:
