Disclosed is a semiconductor transfer device comprising a housing having a surface that has an opening through which a substrate is introduced, and a substrate hold structure that fixes the substrate in the housing. The substrate hold structure includes a lower support that extends onto a bottom surface of the substrate from one of inner surfaces of the housing, and an upper support that extends toward a side of the substrate from one of the inner surfaces of the housing and includes a second hold member. An operation of the upper support causes the second hold member to move onto the substrate such that the second hold member contacts a top surface of the substrate and overlaps the first hold member. An extension part penetrates the housing and protrudes onto an outer surface of the housing.