Invention Grant
- Patent Title: Interlayer of sub-structure having elevations and further sub-structure with filler particles in recesses between the elevations
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Application No.: US17238372Application Date: 2021-04-23
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Publication No.: US12136578B2Publication Date: 2024-11-05
- Inventor: Stefan Schwab , Edmund Riedl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102020111071.5 20200423
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/54 ; H01L21/56 ; H01L23/42 ; H01L23/495
Abstract:
A structure includes a first sub-structure and a second sub-structure coupled with the first sub-structure and being a composite including filler particles in a matrix. A surface of the first sub-structure has a surface profile with first elevations and first recesses configured to enable at least part of the filler particles to at least partially enter the first recesses to thereby form an interlayer including the first elevations of the first sub-structure and filler particles in the matrix of the second sub-structure.
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