Invention Grant
- Patent Title: Imaging device and signal processing device
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Application No.: US17858688Application Date: 2022-07-06
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Publication No.: US12136641B2Publication Date: 2024-11-05
- Inventor: Jun Ogi , Yoshiaki Tashiro , Takahiro Toyoshima , Yorito Sakano , Yusuke Oike , Hongbo Zhu , Keiichi Nakazawa , Yukari Takeya , Atsushi Okuyama , Yasufumi Miyoshi , Ryosuke Matsumoto , Atsushi Horiuchi
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross PC
- Priority: JP2017-055582 20170322,JP2018-045205 20180313
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N25/70 ; H01L31/107

Abstract:
To realize miniaturization of a pixel, reduction in noise, and high quantum efficiency, and to improve short-wavelength sensitivity while suppressing inter-pixel interference and variations for each pixel. According to the present disclosure, there is provided an imaging device including: a first semiconductor layer formed in a semiconductor substrate; a second semiconductor layer of a conductivity type opposite to a conductivity type of the first semiconductor layer formed on the first semiconductor layer; a pixel separation unit which defines a pixel region including the first semiconductor layer and the second semiconductor layer; a first electrode which is connected to the first semiconductor layer from one surface side of the semiconductor substrate; and a second electrode which is connected to the second semiconductor layer from a light irradiation surface side that is the other surface of the semiconductor substrate, and is formed to correspond to a position of the pixel separation unit.
Public/Granted literature
- US20220344386A1 IMAGING DEVICE AND SIGNAL PROCESSING DEVICE Public/Granted day:2022-10-27
Information query
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