Invention Grant
- Patent Title: Coupled polysilicon guard rings for enhancing breakdown voltage in a power semiconductor device
-
Application No.: US17615553Application Date: 2019-06-19
-
Publication No.: US12136646B2Publication Date: 2024-11-05
- Inventor: Kuo-Chang Yang , Sorin Georgescu
- Applicant: POWER INTEGRATIONS, INC.
- Applicant Address: US CA San Jose
- Assignee: POWER INTEGRATIONS, INC.
- Current Assignee: POWER INTEGRATIONS, INC.
- Current Assignee Address: US CA San Jose
- Agent Brian H. Floyd
- International Application: PCT/US2019/037962 WO 20190619
- International Announcement: WO2020/256719 WO 20201224
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/417 ; H01L29/78 ; H01L29/808 ; H01L29/861

Abstract:
Coupled polysilicon guard rings for enhancing breakdown voltage in a power semiconductor device are presented herein. Polysilicon guard rings are disposed above the power device drift region and electrically coupled to power device regions (e.g., device diffusions) so as to spread electric fields associated with an operating voltage. Additionally, PN junctions (i.e., p-type and n-type junctions) are formed within the polysilicon guard rings to operate in reverse bias with a low leakage current between the power device regions (e.g., device diffusions). Low leakage current may advantageously enhance the electric field spreading without deleteriously affecting existing (i.e., normal) power device performance; and enhanced electric field spreading may in turn reduce breakdown-voltage drift.
Public/Granted literature
- US20220238644A1 COUPLED POLYSILICON GUARD RINGS FOR ENHANCING BREAKDOWN VOLTAGE IN A POWER SEMICONDUCTOR DEVICE Public/Granted day:2022-07-28
Information query
IPC分类: