Invention Grant
- Patent Title: Silicon-germanium Fins and methods of processing the same in field-effect transistors
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Application No.: US17126594Application Date: 2020-12-18
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Publication No.: US12136651B2Publication Date: 2024-11-05
- Inventor: Yu-Shan Lu , Hung-Ju Chou , Pei-Ling Gao , Chen-Hsuan Liao , Chih-Chung Chang , Jiun-Ming Kuo , Che-Yuan Hsu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: HAYNES AND BOONE, LLP
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L21/8238 ; H01L27/092 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor structure includes a SiGe fin protruding from a substrate, where the SiGe fin includes a top portion having a first sidewall and a second sidewall and a bottom portion having a third sidewall and a fourth sidewall, and where a first transition region connecting the first sidewall to the third sidewall and a second transition region connecting the second sidewall to the fourth sidewall each have a tapered profile extending away from the first sidewall and the second sidewall, respectively, and a Si-containing layer disposed on the top portion of the SiGe fin, where a portion of the Si-containing layer on the first transition region extends away from the first sidewall by a first lateral distance and a portion of the Si-containing layer on the second transition region extends away from the second sidewall by a second lateral distance that is different from the first lateral distance.
Public/Granted literature
- US20210257462A1 Silicon-Germanium Fins and Methods of Processing the Same in Field-Effect Transistors Public/Granted day:2021-08-19
Information query
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