Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US18357276Application Date: 2023-07-24
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Publication No.: US12136654B2Publication Date: 2024-11-05
- Inventor: Hiroki Miyake
- Applicant: DENSO CORPORATION , MIRISE Technologies Corporation , TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: JP Kariya; JP Nisshin; JP Toyota
- Assignee: DENSO CORPORATION,MIRISE Technologies Corporation,TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: DENSO CORPORATION,MIRISE Technologies Corporation,TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Kariya; JP Nisshin; JP Toyota
- Agency: Posz Law Group, PLC
- Priority: JP2020-157824 20200918
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L21/425 ; H01L29/24 ; H01L29/78 ; H01L29/861 ; H01L29/872

Abstract:
A semiconductor device includes: a first semiconductor layer having an N conductive type and made of a gallium oxide-based semiconductor; and a second semiconductor layer made of a gallium oxide-based semiconductor, in contact with the first semiconductor layer, and having the N conductive type with an electrically active donor concentration higher than an electrically active donor concentration of the first semiconductor layer. A difference between a donor concentration of the first semiconductor layer and a donor concentration of the second semiconductor layer is smaller than a difference between the electrically active donor concentration of the first semiconductor layer and the electrically active donor concentration of the second semiconductor layer.
Public/Granted literature
- US20230369417A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2023-11-16
Information query
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