Invention Grant
- Patent Title: Semiconductor structure having two-dimensional channel
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Application No.: US17486460Application Date: 2021-09-27
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Publication No.: US12136656B2Publication Date: 2024-11-05
- Inventor: Andrew Gaul , Julien Frougier , Ruilong Xie , Andrew M. Greene , Christopher J. Waskiewicz , Kangguo Cheng
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis LLP
- Agent Samuel Waldbaum
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/06 ; H01L29/66 ; H01L29/786

Abstract:
Semiconductor structures are disclosed which comprise semiconductor devices having thin multi-layer channel stacks. In one example, a semiconductor structure comprises a gate structure comprising a multi-layer channel stack. The multi-layer channel stack comprises a first dielectric layer, a second dielectric layer, and a channel layer disposed between the first and second dielectric layers. The semiconductor structure further comprises a first source/drain region disposed on a first side of the gate structure and in electrical contact with a first end portion of the multi-layer channel stack and a second source/drain region disposed on a second side of the gate structure and in electrical contact with a second end portion of the multi-layer channel stack.
Information query
IPC分类: