Invention Grant
- Patent Title: Device integration using carrier wafer
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Application No.: US17489706Application Date: 2021-09-29
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Publication No.: US12136682B2Publication Date: 2024-11-05
- Inventor: Devendra K. Sadana , Ning Li , Ghavam G. Shahidi , Frank Robert Libsch , Stephen W. Bedell
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt & Kammer PLLC
- Agent L. Jeffrey Kelly
- Main IPC: H01L31/12
- IPC: H01L31/12 ; H01L31/18 ; H01L33/00

Abstract:
Compound semiconductor and silicon-based structures are epitaxially formed on semiconductor substrates and transferred to a carrier substrate. The transferred structures can be used to form discrete photovoltaic and light-emitting devices on the carrier substrate. Silicon-containing layers grown on doped donor semiconductor substrates and compound semiconductor layers grown on off-cut semiconductor substrates form elements of the devices. The carrier substrates may be electrically insulating substrates or include electrically insulating layers to which photovoltaic and/or light-emitting structures are bonded.
Public/Granted literature
- US20230116053A1 DEVICE INTEGRATION USING CARRIER WAFER Public/Granted day:2023-04-13
Information query
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