Invention Grant
- Patent Title: Method for manufacturing light emitting apparatus, light emitting apparatus, and projector
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Application No.: US17536139Application Date: 2021-11-29
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Publication No.: US12136684B2Publication Date: 2024-11-05
- Inventor: Takashi Miyata
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2020-198137 20201130
- Main IPC: H01L33/04
- IPC: H01L33/04 ; G03B21/20 ; H01L33/00

Abstract:
A method for manufacturing a light emitting apparatus according to an aspect of the present disclosure includes forming a light emitting section on a substrate, the light emitting section including a group of columnar sections formed of a plurality of columnar sections each including a light emitting layer, forming a first insulating layer on the substrate so as to cover the light emitting section, etching the tip of a protrusion-shaped section that contains the same substance as the substance of which the light emitting section is made and protrudes beyond the first insulating layer, forming a second insulating layer on the first insulating layer, and forming an electrode to be electrically coupled to the light emitting section on the second insulating layer.
Public/Granted literature
- US20220173266A1 METHOD FOR MANUFACTURING LIGHT EMITTING APPARATUS, LIGHT EMITTING APPARATUS, AND PROJECTOR Public/Granted day:2022-06-02
Information query
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