Invention Grant
- Patent Title: MMIC device on a substrate and mounted within a waveguide block, wherein a metal foil layer extends from the substrate to form in part a through hole
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Application No.: US17769755Application Date: 2020-10-16
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Publication No.: US12136757B2Publication Date: 2024-11-05
- Inventor: Byron Alderman , Jeffrey Powell
- Applicant: TERATECH COMPONENTS LIMITED
- Applicant Address: GB Didcot
- Assignee: TERATECH COMPONENTS LIMITED
- Current Assignee: TERATECH COMPONENTS LIMITED
- Current Assignee Address: GB Didcot
- Agency: Withrow + Terranova, PLLC
- Agent Vincent K. Gustafson
- Priority: GB1915109 20191018
- International Application: PCT/GB2020/052614 WO 20201016
- International Announcement: WO2021/074642 WO 20210422
- Main IPC: H01P3/12
- IPC: H01P3/12 ; H01P5/107

Abstract:
An electronic device comprises a waveguide block defining a cavity therein. The device has a monolithic microwave or millimetre-wave integrated circuit device positioned at least partially in the cavity. The integrated circuit device comprises a dielectric substrate and a metal foil layer that extends outwards from an external edge of the dielectric substrate. The metal foil layer and the dielectric substrate define a through hole, wherein a first edge of the through hole is an edge of the metal foil layer and defines an end of the elongate waveguide channel, and wherein the metal foil layer at least partly determines both a length and a width of an elongate waveguide channel within the cavity.
Public/Granted literature
- US20220376375A1 WAVEGUIDES Public/Granted day:2022-11-24
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