A high-frequency circuit includes: a first ground layer having an electric conductor formed therein; a second ground layer having an electric conductor formed therein; and a conductive pattern layer having a first conductive pattern formed thereon. The first ground layer, the second ground layer, and the conductive pattern layer are laminated one on another. The conductive pattern layer includes a first area in which a distance to the electric conductor formed in the second ground layer is longer than a distance to the electric conductor formed in the first ground layer, in a lamination direction in which the first ground layer, the second ground layer, and the conductive pattern layer are laminated. At least a part of the first conductive pattern is disposed in the first area.