Invention Grant
- Patent Title: Composite substrate for surface acoustic wave device and manufacturing method thereof
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Application No.: US17308422Application Date: 2021-05-05
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Publication No.: US12136907B2Publication Date: 2024-11-05
- Inventor: Masayuki Tanno , Shoji Akiyama
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Priority: JP2020-086299 20200515
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H3/08 ; H03H9/64 ; H10N30/00 ; H10N30/072

Abstract:
A piezoelectric composite substrate for SAW devices with small loss is provided. A composite substrate for a surface acoustic wave device according to one embodiment of the present invention has a piezoelectric single crystal thin film, a support substrate, and a first intervening layer between the piezoelectric single crystal thin film and the support substrate. In said composite substrate, the first intervening layer is in contact with the piezoelectric single crystal thin film, and the acoustic velocity of the transverse wave in the first intervening layer is faster than the acoustic velocity of the fast transverse wave in the piezoelectric single crystal thin film.
Public/Granted literature
- US20210359660A1 COMPOSITE SUBSTRATE FOR SURFACE ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-11-18
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