Invention Grant
- Patent Title: Physical layer to link layer interface and related systems, methods and devices
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Application No.: US17823384Application Date: 2022-08-30
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Publication No.: US12137156B2Publication Date: 2024-11-05
- Inventor: Venkat Iyer , Dixon Chen , John Junling Zang , Shivanand I. Akkihal
- Applicant: Microchip Technology Incorporated
- Applicant Address: US AZ Chandler
- Assignee: Microchip Technology Incorporated
- Current Assignee: Microchip Technology Incorporated
- Current Assignee Address: US AZ Chandler
- Agency: TraskBritt
- Priority: CN201910785147.9 20190829
- Main IPC: H04L7/00
- IPC: H04L7/00 ; H04L69/323

Abstract:
Disclosed embodiments relate, generally, to improved data reception handling at a physical layer. Some embodiments relate to end of line systems that include legacy media access control (MAC) devices and PHY devices that implement improved data reception handling disclosed herein. The improved data reception handling improves the operation of legacy systems, and the MAC more specifically, and in some cases to comply with media access tuning protocols implemented at the physical layer.
Public/Granted literature
- US20220416992A1 PHYSICAL LAYER TO LINK LAYER INTERFACE AND RELATED SYSTEMS, METHODS AND DEVICES Public/Granted day:2022-12-29
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