Invention Grant
- Patent Title: Surface wave launcher for high-speed data links over high-voltage power lines with loss compensation structure
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Application No.: US17353866Application Date: 2021-06-22
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Publication No.: US12137517B2Publication Date: 2024-11-05
- Inventor: Vishram Shriram Pandit , Neel Harkishin Bhatia , Rajiv Panigrahi , Ramaswamy Parthasarathy , Satish Ramachandra , Ajay Sharma , Manish Sharma , Vaibhavdeep Singh , Ravichandra Tungani Chikkabasavaiah , Jayprakash Thakur
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: VIERING, JENTSCHURA & PARTNER MBB
- Priority: IN202041046396 20201023
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01P3/10

Abstract:
A wave launcher may include a printed circuit board (PCB) that includes a pin that receives a radio frequency (RF) signal. The wave launcher may include a cylinder configured to be electrically coupled to the pin and define an opening. The cylinder may receive the RF signal from the pin, form a transition from coplanar to Goubau line structure with a plate, and generate the surface wave. The wave launcher may include an insulator configured to be physically positioned within the opening and between the cylinder and a power line. The insulator may mechanically isolate the cylinder from the power line and permit the cylinder to launch the surface wave on the power line. The wave launcher may include the plate electrically coupled to a pad and may provide a reference for the pin and the cylinder. The pin and the cylinder may be physically positioned proximate the plate.
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