Invention Grant
- Patent Title: Planar lightwave circuit structure based on printed circuit board and manufacturing method thereof
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Application No.: US17899169Application Date: 2022-08-30
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Publication No.: US12137519B2Publication Date: 2024-11-05
- Inventor: Mingdi Wang , Zilin Tang
- Applicant: SOOCHOW UNIVERSITY
- Applicant Address: CN Suzhou
- Assignee: SOOCHOW UNIVERSITY
- Current Assignee: SOOCHOW UNIVERSITY
- Current Assignee Address: CN Suzhou
- Agency: Hemisphere Law, PLLC
- Agent Zhigang Ma
- Priority: CN202210099574.3 20220127
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G02B6/122 ; G02B6/138 ; G02B6/12 ; H05K3/14 ; H05K3/24

Abstract:
A planar lightwave circuit structure based on a printed circuit board and its manufacturing method are provided. The manufacturing method includes: S1, preparing the printed circuit board; S2, adhering the lower cladding layer to one side of the printed circuit board, and then annealing process carried out; S3, jetting a lightwave circuit material on an upper surface of the lower cladding layer in a predetermined route through an electrohydrodynamic jet printing device to form lightwave circuit lines to be cured, the lightwave circuit material being a slurry containing silver ions and an ultraviolet (UV) curing agent; S4, curing the lightwave circuit lines through irradiation of UV light, the UV light irradiating onto the lightwave circuit lines through a lens assembly with slits; and S5, depositing an upper cladding layer on the lower cladding layer and the lightwave circuit lines, and then solidifying treatment carried out.
Public/Granted literature
- US20230240003A1 PLANAR LIGHTWAVE CIRCUIT STRUCTURE BASED ON PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-07-27
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