Invention Grant
- Patent Title: Wiring circuit board
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Application No.: US17783537Application Date: 2020-12-15
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Publication No.: US12137522B2Publication Date: 2024-11-05
- Inventor: Rihito Fukushima , Shusaku Shibata , Teppei Niino
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils LLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2019-228698 20191218
- International Application: PCT/JP2020/046742 WO 20201215
- International Announcement: WO2021/125166 WO 20210624
- Main IPC: H05K1/05
- IPC: H05K1/05 ; H05K1/09 ; H05K1/18 ; H05K3/32

Abstract:
A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.
Public/Granted literature
- US20230015337A1 WIRING CIRCUIT BOARD Public/Granted day:2023-01-19
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