- Patent Title: Electromagnetic and thermal shields with low-dimensional materials
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Application No.: US17455280Application Date: 2021-11-17
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Publication No.: US12137546B2Publication Date: 2024-11-05
- Inventor: Alexander A. Balandin , Fariborz Kargar
- Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Applicant Address: US CA Oakland
- Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee Address: US CA Oakland
- Agency: Buchanan Ingersoll & Rooney PC
- Main IPC: B32B27/18
- IPC: B32B27/18 ; B32B27/38 ; C08G59/30 ; C08K3/04 ; C08K7/04 ; H05K9/00
Abstract:
An electromagnetic interface (EMI) shielding material and method for producing the electromagnetic interface (EMI) shielding material. The EMI shielding material including a polymer matrix and a van der Waals material embedded in the polymer matrix and forming quasi-one-dimensional atomic threads, and wherein the van der Waals material is a trichalcogenide compound.
Public/Granted literature
- US20220264775A1 ELECTROMAGNETIC AND THERMAL SHIELDS WITH LOW-DIMENSIONAL MATERIALS Public/Granted day:2022-08-18
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