Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the semiconductor device
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Application No.: US18099136Application Date: 2023-01-19
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Publication No.: US12137563B2Publication Date: 2024-11-05
- Inventor: Kang Sik Choi
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si Gyeonggi-do
- Agency: WILLIAM PARK & ASSOCIATES LTD.
- Priority: KR10-2018-0029360 20180313
- Main IPC: H10B43/27
- IPC: H10B43/27 ; H01L21/764 ; H01L21/768 ; H01L29/06 ; H10B43/35

Abstract:
A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a well structure, a first channel pillar and a second channel pillar extending from an inside of the well structure in an upward direction, a semiconductor pattern coupled between the first channel pillar and the second channel pillar and having a gap disposed in a central region of the semiconductor pattern, and a source junction formed in the semiconductor pattern.
Public/Granted literature
- US20230157025A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE Public/Granted day:2023-05-18
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