Invention Grant
- Patent Title: Three dimensional memory device
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Application No.: US17566313Application Date: 2021-12-30
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Publication No.: US12137570B2Publication Date: 2024-11-05
- Inventor: Chia-Ta Yu , Chia-En Huang , Yi-Ching Liu , Yih Wang , Sai-Hooi Yeong , Yu-Ming Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: MERCHANT & GOULD P.C.
- Main IPC: H10B51/30
- IPC: H10B51/30 ; H10B51/20

Abstract:
A memory device includes a three dimensional memory array having memory cells arranged on multiple floors in rows and columns. Each column is associated with a bit line and a select line. The memory device further includes select gate pairs each being associated with a column. The bit line of a column is connectable to a corresponding a global bit line through a first select gate of a select gate pair associated with the column and a select line of the column is connectable to a corresponding global select line through the second select gate of the select gate pair associated with the column. The plurality of select gate pairs are formed in a different layer than the plurality of memory cells.
Public/Granted literature
- US20220328502A1 THREE DIMENSIONAL MEMORY DEVICE Public/Granted day:2022-10-13
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