Invention Grant
- Patent Title: Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
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Application No.: US18323160Application Date: 2023-05-24
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Publication No.: US12142476B2Publication Date: 2024-11-12
- Inventor: Masayuki Asai , Tomoki Imamura , Kazuyuki Okuda , Yasuhiro Inokuchi , Norikazu Mizuno
- Applicant: Kokusai Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Kokusai Electric Corporation
- Current Assignee: Kokusai Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Volpe Koenig
- Priority: JP2019-093761 20190517
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/458 ; C23C16/50 ; C23C16/52 ; H01L21/673

Abstract:
Provided is processing of a substrate including: forming film on substrate by performing cycle, multiple times, including non-simultaneously performing: (a) supplying precursor gas and inert gas to the substrate; and (b) supplying reaction gas to the substrate. In (a), at least one of the precursor and inert gas stored in first tank is supplied to the substrate, and at least one of the precursor and inert gas stored in second tank is supplied to the substrate. A concentration of the precursor gas in the first tank differs from that in the second tank. Further, in (a), the at least one of the precursor and inert gas is supplied from the first tank to the substrate, and the at least one of the precursor and inert gas is supplied from the second tank to the substrate to suppress multiple adsorption of molecules constituting the precursor gas on the substrate's surface.
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Information query
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