- Patent Title: Method for treating substrate and apparatus for treating substrate
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Application No.: US16952071Application Date: 2020-11-18
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Publication No.: US12142492B2Publication Date: 2024-11-12
- Inventor: Ji-Hwan Lee , Seong Gil Lee , Dong Sub Oh , Myoungsub Noh , Dong-Hun Kim , Wan Jae Park
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Cheonan-si
- Priority: KR10-2019-0149016 20191119
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01J37/32 ; H01L21/687
Abstract:
A method for processing a substrate includes providing the substrate, a film being formed on the substrate, performing pretreatment to surface-treat the film formed on the substrate using a treatment gas in a plasma state, and performing, after the pretreatment, liquid treatment to remove the film from the substrate by supplying a treatment liquid onto the substrate.
Public/Granted literature
- US20210151333A1 METHOD FOR TREATING SUBSTRATE AND APPARATUS FOR TREATING SUBSTRATE Public/Granted day:2021-05-20
Information query
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