Invention Grant
- Patent Title: Substrate holding device
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Application No.: US17253127Application Date: 2019-06-18
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Publication No.: US12142504B2Publication Date: 2024-11-12
- Inventor: Kazuhiko Irisawa
- Applicant: NISSIN ELECTRIC CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: NISSIN ELECTRIC CO., LTD.
- Current Assignee: NISSIN ELECTRIC CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: JCIPRNET
- Priority: JP2018-117145 20180620
- International Application: PCT/JP2019/024073 WO 20190618
- International Announcement: WO2019/244880 WO 20191226
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B23P11/00 ; B25B11/00 ; B65G49/06 ; H01L21/683 ; H01L21/687

Abstract:
A substrate holding device includes: a frame body on which a substrate transferred by a transfer device is mounted, and a substrate delivery mechanism for delivering, to the frame body, the substrate transferred to the above of the frame body by the transfer device. The substrate delivery mechanism includes: a support pin arranged below the frame body, a support pin advancing/retreating mechanism for advancing and retreating the support pin between a support pin lifting/lowering position set on a lower side inside the frame body and a support pin retracting position set outside the frame body, and a support pin lifting/lowering mechanism by which the support pin arranged in the support pin lifting/lowering position by the support pin advancing/retreating mechanism is lowered after being lifted so as to pass through the interior of the frame body and support the substrate.
Public/Granted literature
- US20210292106A1 SUBSTRATE HOLDING DEVICE Public/Granted day:2021-09-23
Information query
IPC分类: