Invention Grant
- Patent Title: Wafer processing tools and methods thereof
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Application No.: US18348146Application Date: 2023-07-06
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Publication No.: US12142513B2Publication Date: 2024-11-12
- Inventor: Jagan Rangarajan , Edward Golubovsky , Shaun Van Der Veen , Justin Ho Kuen Wong , Steven M. Zuniga
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B24B41/06 ; H01L21/67 ; H01L21/687
Abstract:
A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.
Public/Granted literature
- US20230352337A1 WAFER PROCESSING TOOLS AND METHODS THEREOF Public/Granted day:2023-11-02
Information query
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