Invention Grant
- Patent Title: Reduced vertical profile ejector for liquid cooled modules
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Application No.: US17134028Application Date: 2020-12-24
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Publication No.: US12144110B2Publication Date: 2024-11-12
- Inventor: Guixiang Tan , Xiang Li , Casey Winkel , George Vergis
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K5/00 ; H05K5/02 ; H05K7/20
Abstract:
An apparatus is described. The apparatus includes a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors. The ejectors have a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.
Public/Granted literature
- US20210120670A1 REDUCED VERTICAL PROFILE EJECTOR FOR LIQUID COOLED MODULES Public/Granted day:2021-04-22
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